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MOSFET总览

2N7002K

  • Package

    SOT-23

  • Transistor Polarity

    N-Channel

  • Number of Channels

    1

  • VDS

    60V

  • Features

    • Advanced Trench Process Technology
    • High Density Cell Design For Ultra Low On-Resistance
    • Very Low Leakage Current In Off Condition
    • Specially Designed for Battery Operated Systems, Solid-State Relays
    Drivers : Relays, Displays, Lamps, Solenoids, Memories, etc.
    • ESD Protected 2KV HBM
    • Lead free in compliance with EU RoHS2.0
    (2011/65/EU & 2015/865/EU directive)
    • Green molding compound as per IEC61249 Std. . (Halogen Free)

Maximum RATINGS and Thermal Characteristics (TA=25°C unless otherwise noted )

PARAMETER Symbol Limit Units
Drain-Source Voltage VDS 60 V
Gate-Source Voltage VGS ±20 V
Continuous Drain Current ID 300 mA
Pulsed Drain Current 1 IDM 2000 mA
Maximum Power Dissipation
TA 25°C
PD 500 mW
Operating Junction and Storage Temperature Range TJ1 TSTG -55 to +150 °C
Junction-to Ambient Thermal Resistance (PCB mounted) 2 RθJA 250 °C/W

ELECTRICAL CHARACTERISTICS

Parameter Symbol Test Conditon Min. Typ. Max. Units
Drain-Source Breakdown Voltage BVDSS VGS=0V, ID=10μA 60 - - V
Gate Threshold Voltage VGS(th) VDS=VGS, ID=250μA 1 - 2.5 V
Drain-Souce On-State Resistance RDS(ON) VGS=10V, ID=500mA - - 3.0 Ω
Drain-Souce On-State Resistance RDS(ON) VGS=4.5V, ID=200mA - - 4.0 Ω
Zero Gate Voltage Drain Current IDSS VDS=60V, VGS=0V - - 1 μA
Gate Body Leakage IGSS VGS=±20V, VDS=0V - - ±10 μA
Forward Transconductance grs VDS=15V, ID=250mA 100 - - mS
Dynamic
Total Gate Charge Qg VDS=15V
ID=200mA
VGS=4.5V
- - 0.8 nC
Turn-On Delay Time td(on) VDD=30V
RL=150Ω
ID=200mA
VGEN=10V
RG=10Ω
- - 2.7 ns
Turn-Off Delay Time td(off) VDD=30V
RL=150Ω
ID=200mA
VGEN=10V
RG=10Ω
- - 15 ns
Input Capacitance Ciss VDS=25V
VGS=0V
f-1.0MHz
- - 35 pF
Output Capacitance Coss VDS=25V
VGS=0V
f-1.0MHz
- - 13 pF
Reverse Transfer Capacitance Crss VDS=25V
VGS=0V
f-1.0MHz
- - 8 pF
Diode Forward Voltage VSD IS+200mA, VGS=0V - 0.82 1.3 V
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