Transient Voltage Suppressors
5KMC60AS
Active
-
Package
SMC
-
Voltage
60V
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Power
5000W
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Configuration
UNI
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Application
Server Motherboard, I/O Interface
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Features
• For surface mounted applications in order to optimize board space.
• Package suitable for automated handling
• Low inductance
• High temperature soldering : 260°C/10 seconds at terminals
• Lead free in compliance with EU RoHS 2.0
• Green molding compound as per IEC 61249 standard
Maximum Ratings and Thermal Characteristics (TA = 25°C unless otherwise noted)
| PARAMETER | SYMBOL | LIMIT | UNITS |
|---|---|---|---|
| Peak Pulse Power Dissipation(tp = 10/1000 us) | PPP | 5000 | W |
| Peak Pulse Current on tp= 10/1000 us waveform | IPPM | See Datasheet | A |
| Power Dissipation on Infinite Heat Sink at TL = 50°C | PD | 6.5 | W |
| Peak Forward Surge Current (8.3ms single half sine-wave) for Unidirectional only | IFSM | 300 | A |
| ESD IED 61000-4-2(Air) | VESD | ±30 | kV |
| ESD IED 61000-4-2(Contact) | VESD | ±30 | kV |
| Typical Thermal Resistance Junction to Ambient | RθJA | 125 | °C/W |
| Operation Junction Temperature Range | TJ | -55~150 | °C |
| Storage Temperature Range | TSTG | -55~150 | °C |
Electrical Characteristics (TA = 25°C unless otherwise noted)
| SYMBOL | MIN. | TYP. | MAX. | UNITS |
|---|---|---|---|---|
| VRRM | 60 | - | V | |
| VBR | 66.7 | 73.7 | V | |
| IT | - | 1 | mA | |
| IR@VRWM | - | 5 | uA | |
| VC@IPP | - | 96.8 | V | |
| VC@IPP | - | 51.7 | A | |
| Typical Temp. Coefficient of VBR |
- | 0.078 | %/℃ |