Maximum Ratings and Thermal Characteristics (TA = 25°C unless otherwise noted)
PARAMETER | SYMBOL | Number | Unit |
---|---|---|---|
ESD IEC61000-4-2(Air) ESD IEC61000-4-2(Contact) |
VESD | ±18 ±16 |
kV |
Typical Thermal Resistance | RθJA | 350 | oC/W |
Operating Junction Temperature Range | TJ | -55~125 | oC |
Storage Temperature Range | TSTG | -55~150 | oC |
Electrical Characteristics (TA = 25°C unless otherwise noted)
PARAMETER | SYMBOL | TEST CONDITION | MIN. | TYP | MAX. | UNITS |
---|---|---|---|---|---|---|
Reverse Stand-Off Voltage | VRWM | I/O Pin to GND | - | - | 5 | V |
Reverse Breakdown Voltage | VBR | IBR=1mA, I/O Pin to GND | 6 | - | 11 | V |
Forward Voltage | VF | IF= 15mA, I/O Pin to GND | - | 1 | - | V |
Reverse Leakage Current | IR | VR=5V, I/O Pin to GND | - | 0.5 | 1 | uA |
Surge Clamping Voltage (8/20 us) | VCL | IPP=6.5A, tP=8/20µs, any I/O pins to GND | - | 8 | 9 | V |
Clamping Voltage TLP (tperiod=100ns,tr=1ns) | VCL | ITLP=16A, tP=100ns, any I/O Pin to GND | - | 10.5 | - | V |
Off State Junction Capacitance | CJ | VR=2.5V, f=1MHz, I/O any pins to GND | - | 0.4 | 0.5 | pF |